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Books
There are several excellent books covering the various technologies of interest to MCM technologists and users. These books contain information about the design, test, analytical evaluation and manufacture of MCMs. The books on this page are primarily those which address MCM-specific issues, and whose content address the technology in terms of MCM applications. Other books, such as those on CAD or PWB design, also contain information of interest to MCM techologists/users, but are generally not included on this page.

Recommendations Procedings All Books

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Recommendations

This is a pretty subjective list - the books I would recommend for the MCM technologist. Everyone has their favorite book, the one that sits on their bookshelf and has a hundred pages dog-eared to point out the information that they use the most. That's the criteria that I've used here - books that have stood the test of time and are the ones that I use the most.

Having said that, the good news is that the first few on my list also correspond to the books that have sold the most copies (according to Amazon). It's only after the first few "classics" that personal interests seem to make a difference.

Electronic Packaging and Interconnection Handbook, 3rd Edition
Charles A. Harper
February 2000
$125
McGraw-Hill
0071347453
bk022.jpg
Thermal Management Handbook: For Electronic Assemblies
Al Krum
April 1988
$89.50
McGraw-Hill
0070266999
bk002.jpg

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Proceedings

While books are an excellent source of information, sometimes the most recent concepts or ideas are presented at the various Conferences and Symposia within the packaging/MCM community. Even though the proceedings are often published, unless you look in detail at the papers presented it can be difficult to know whether the proceedings contains information that you need to have.

As time goes on, I'll attach comments to the listings of any papers that have drawn special interest, or that be of special interest to site visitors. If you would like to recommend any proceedings, please send your comments to me via email.

Title
Author
Date
ISBN
Publisher
ISBN
image file name

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MCM Books

Strictly speaking, a list of all MCM-related books would cover a wide range of topics, including manufacturing processes, electrical test, and even program management. But I've tried to keep the following list narrowed to those books which specifically discuss provide overviews of MCM and packaging technologies and which discuss primarily development issues associated with MCMs. The books are listed in alphabetical order.

Advanced Electronic Packaging: With Emphasis on Multichip Modules IEEE Press Series on Microelectronic Systems
William D. Brown
October 1998
$130.00
IEEE Press
0780347005
bk004.jpg
An Investigation Into the Cost-Effectiveness of Multi-Chip Modules for massively parallel computing applications
Claus Habiger
-
-
Hartung-Gorre
ASIN 3891918844
bk023.jpg
Application of Fracture Mechanics in Electronic Packaging
William T. Chen, et al
January 1997
$90.00
ASME
0791818276
bk024.jpg
Chip on Board Technologies for Multichip Modules
John H. Lau, John H. Law
January 1994
$167.00
Kluwer Academic Publishers
0442014414
bk012.jpg
Conceptual Design of Multichip Modules and Systems
Kluwer International Series in Engineering and Computer Science
Peter A. Sandborn, Hector Moreno
January 1994
Kluwer Academic Publishers
0792393953
bk014.jpg
Electronic Packaging & Interconnection Handbook, 3rd Edition
Charles A. Harper
February 2000
$125
McGraw-Hill
0071347453
bk022.jpg
Electronics Packaging Forum: Multichip Module Technology Issues
James E. Morris, Thomas J. Watson
March 1994
$79.95
IEEE Press
078030439X
bk013.jpg
Flip Chip Technologies
John H. Lau
December 1995
$87.51
McGraw-Hill
0070366098
bk003.jpg
High Performance Design Automation for MultiChip Modules and Packages
Jun-Dong Cho, Paul D. Franzon
June 1996
$68.00
World Scientific Publishing Company
9810223072
bk008.jpg
Hybrid Assemblies and Multichip Modules
Fred W. Kear
December 1992
$135.00
McGraw-Hill
0071351418
bk016.jpg
Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability
Michael Pecht
February 1994
$140.00
Wiley
0471594466
bk001.jpg
Introduction to Multichip Modules
Naveed Sherwani
December 1995
$99.50
Wiley
0471114383
bk009.jpg
Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies
John H. Lau
February 2000
$89.95
McGraw-Hill
0071351418
bk015.jpg
MCM C/Mixed Technologies and Thick Film Sensors
NATO Advanced Research Institute on Ceramic
May 1995
$231.50
Kluwer Academic Publishers
0792334604
bk026.jpg
Microelectronic System Interconnections: Performance and Modeling
Stuart K. Tewksbury
August 1993
-
IEEE Press
0780304055
bk010.jpg
Multichip Module Design, Fabrication, and Testing Electronic Packaging and Interconnection
James J. Licari
January 1995
-
McGraw-Hill
ASIN 0070377154
bk018.jpg
Multichip Module Technology Handbook
Philip E. Garrou, Iwona Turlik
September 1997
$99.50
McGraw-Hill
007023552X
bk006.jpg
MultiChip Module Test Strategies Frontiers in Electronic Testing
Yervant Zorian
March 1997
$134
Kluwer Academic Publishers
079239920X
bk028.jpg
Multichip Modules
Ernest S. Kuh
March 1992
$79.00
World Scientific Publishing Company
9810209258
bk020.jpg
Multichip Modules and Related Technologies: MCM, Tab, and Cob Design Electronic Packaging and Interconnection Series
Gerald L. Ginsberg, Donald Schnorr
March 1994
-
McGraw-Hill
0070228949
bk029.jpg
Multichip Modules With Integrated Sensors
W. Kinzy Jones, Gabor Harsanyi
October 1996
$276
Kluwer Academic Publishers
0792341945
bk030.jpg
Multichip Modules: Systems Advantages, Major Constructions, and Materials Technologies
R. Wayne Johnson
December 1991
-
IEEE Press
ASIN 087942267X
bk011.jpg
Multichip Packaging and Bare Chip Systems
Brent J. Knipfer
-
-
Business Communications Co.
ASIN 156965204X
bk031.jpg
Physical Design for Multichip Modules
M. Sriram, S.M. Kang
April 1994
$177.50
Kluwer Academic Publishers
079239450X
bk021.jpg
Prevalent Single Chip Packages for Integrated Circuit Packages
David Kellerman
-
-
Business Communications Co.
ASIC 1569652473
bk032.jpg
Roadmaps of Packaging Technology
Eric Bogatin
January 1997
-
Integrated Circuit Engineering
1877750611
bk033.jpg
Routing in the Third Dimension: From VLSI Chips to MCMs
N. A. Sherwani
June 1995
-
IEEE Press
9995891840
bk019.jpg
Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies
John H. Lau, Yi-Hsin Pao
September 1996
$65.00
McGraw-Hill
0070366489
bk005.jpg
Thermal Management Handbook: For Electronic Assemblies
Al Krum
April 1988
$89.50
McGraw-Hill
0070266999
bk002.jpg
Thin Film Multichip Modules
George Messner
April 1992
-
IMAPS
0930815335
bk017.jpg