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GBIC >> MCM >> Design - Interconnects

Design - Interconnects
Whether a standalone interconnect that is dropped into a package, or an interconnect that is integral to the package, interconnects are where most of the action is in MCM design. Thick film interconnects dominated the industry for years - being well suited to the analog modules of the time. Volume production costs for thick film were eased by the development of both high temperature and low temperature cofired technologies. As the electronics turned digital and as frequencies edged updwards, the multilayer thin film industry was developed. Today, the market for these higher performance technologies are slowly being encroached by developments in laminate interconnects.

Thick Film Cofired Thin Film Laminate


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Thick Film


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Thin Film


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Thin Film


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Laminates