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GBIC >>
MCM >> Design - Interconnects
Design - Interconnects
Whether a standalone interconnect that is dropped into a package, or an
interconnect that is integral to the package, interconnects are where most
of the action is in MCM design. Thick film interconnects dominated the
industry for years - being well suited to the analog modules of the time.
Volume production costs for thick film were eased by the development of
both high temperature and low temperature cofired technologies. As the
electronics turned digital and as frequencies edged updwards, the multilayer
thin film industry was developed. Today, the market for these higher
performance technologies are slowly being encroached by developments
in laminate interconnects.
Thick Film
Cofired
Thin Film
Laminate
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Thick Film
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Thin Film
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Thin Film
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Laminates
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