University List Engineering Research Centers
Industry/University Cooperative Research Centers

University List

Alfred University	Center for Advanced Ceramic Technology (CACT) materials, ceramics, electronic packaging
Arizona State University	Electronics Packaging Laboratory Inactive? - last update 5/98
Auburn University	Laboratory for Electronics Assembly and Packaging assembly, packaging, reliability testing, failure analysis Microelectronics Science and Technology Center thick/thin film MCMs, PCBs, design, modeling, interconnect fabrication
Binghamton University	Integrated Electronics Engineering Center (IEEC) electronics manufacturing, electronics packaging and assembly
Clemson University	Center for Semiconductor Device Reliability Research failure analysis, characterization, reliability
Cornell University	Advanced Electronic Packaging Facility electronic packaging & materials, photolithography, metal deposition, assembly processes Alliance for Electronic Packaging interconnects, materials, thermal management
Georgia Institute of Technology	Manufacturing Research Center electronic packaging, polymers, composites, SMT, PWB assembly, design methodology, ceramics Microsystems Packaging Research Center (PRC) system-level packaging of electronics, SOP (System-on-a-Package), wafer-level packaging Microelectronics Research Centers (MiRC) microelectronics, integrated optoelectronics, and microsensors and actuators Low-Cost Electronic Packaging Research Center Inactive?
Indiana University	Electronics Manufactcuring Productivity Facility COTS use in DoD, cost of ownership, environmental testing
Lehigh University	Center for Manufacturing Systems Engineering manufacturing
Mayo Clinic	Electronic Packaging packages, high-speed operation, MCMs
North Carolina State University	Electronics Research Laboratory advanced electronic packaging and interconnect, MEMS (micromachines), vacuum microelectronics
Purdue University	Center for Information and Numberical Data Analysis and Synthesis packaging materials property database
Rensselaer Polytechnic Institute	Center for Integrated Electronics materials characterization and modeling, optoelectronics, advanced packaging, design/manufacturing integration
State University of New York at Buffalo	Electronic Packaging Laboratory develop computational/experimental tools for next generation electronic packaging
University of Arizona	Center for Optoelectronic Devices, Interconnects and Packaging optoelectronics, device assembly, thermal/stress modeling, optical interconnections Center for Electronic Packaging Research (CEPR) modeling/simulation of electrical and thermal characteristics of electronic device packages
University of Arkansas	High Density Electronics Center electronic packaging, materials, low cost MCM design techniques, LTCC, electrical modeling, environmental testing
University of Colorado	Center for Advanced Manufacturing and Packaging of Microwave, Optical and Digital Electronics electronics packaging/manufacturing technologies, low cost systems, microwave/millimeter-wave/digital integration
University of Maryland	Center for Optoelectronic Devices, Interconnects and Packaging optoelectronics, device assembly, thermal/stress modeling, optical interconnections Computer Aided Life Cycle Engineering (CALCE) Electronic Products & Systems Center physics-of-failure (PoF), reliability, life cycle prediction, accelerated testing, electronic parts selection and management
University of Texas at Arlington	Center for Electronic Materials, Devices and Systems electronic materials, electronic/microwave/electro-optical devices
University of Texas at Austin	Microelectronic Research Center materials, optoelectronics and nanophotonics, electronic devices, interconnects and packaging
West Virginia University	Microelectronic Systems Research Center design/prototyping of electronic systems, microfabrication facilities, photonics, microstructure testing and analysis.

Engineering Research Centers

NSF Engineering Research Centers Program

For your convenience, here is the description of the ERCs as provided by the NSF:

The National Science Foundation-sponsored Engineering Research Centers (ERCs) are a group of engineered systems-focused, interdisciplinary centers located at universities all across the United States, each in close partnership with industry. ERCs provide an environment in which academe and industry can collaborate in pursuing strategic advances in complex engineered systems and systems-level technologies important for the Nation's future. Activity within ERCs lies at the interface between the discovery-driven culture of science and the innovation-driven culture of engineering. The centers provide the intellectual foundation for industry to collaborate with faculty and students on resolving generic, long-range challenges, producing the knowledge base needed for steady advances in technology and their speedy transition to the marketplace.

ERCs integrate engineering education and research and expose prospective students (both graduate and undergraduate) to industrial views in order to build competence in engineering practice and to produce engineering graduates with the depth and breadth of education needed for success in technological innovation and for effective leadership of interdisciplinary teams throughout their careers.

Important Notice: The current ERC Competition (NSF 02-24) is underway with awards expected in the summer of 2003. The next round of awards is expected for the winter of 2005. The solicitation is expected to be released in the spring of 2003 and preproposals might then be due in the fall of 2003. You may refer to the current program solicitation for the program and proposal requirements to date.

Industry/University Cooperative Research Centers (I/UCRC)

The I/UCRC programs relevant to MCMs are contained in the composite list of University sites given above. For more information go to the following NSF web site:

NSF Engineering Research Centers Program